期刊文献+

Numerical simulation of copper based filler metal droplets spreading under arc brazing 预览 被引量:1

Numerical simulation of copper based filler metal droplets spreading under arc brazing
在线阅读 下载PDF
收藏 分享 导出
摘要 The spreading behavior of copper filler metal droplets under arc brazing was studied by numerical simulation method using Surface Evolver software. The mathematical model in which arc pressure force acceleration was added to the droplet microelement as the form of gravity acceleration was used in numerical simulation. Then the 3D filler metal droplet profile for different welding currents was simulated. The results show that the simulation results and the experimental results are in good accordance. And it can be seen that the spreading height decreases and diameter increases with the increasing welding current in an approximate linear relation. The spreading behavior of copper filler metal droplets under arc brazing was studied by numerical simulation method using Surface Evolver software. The mathematical model in which arc pressure force acceleration was added to the droplet microelement as the form of gravity acceleration was used in numerical simulation. Then the 3D filler metal droplet profile for different welding currents was simulated. The results show that the simulation results and the experimental results are in good accordance. And it can be seen that the spreading height decreases and diameter increases with the increasing welding current in an approximate linear relation.
作者 于治水 李瑞峰 祁凯 周方明 Yu ZhiShui;Li RuiFeng;Qi Kai;Zhou FangMing
出处 《中国有色金属学会会刊:英文版》 EI CSCD 2005年第4期 818-822,共5页 Transactions of Nonferrous Metals Society of China
基金 国家自然科学基金,江苏省高校自然科学基金
关键词 金属加工 焊接工艺 电弧焊 copper filler metal arc brazing spreading numerical simulation
  • 相关文献

参考文献12

  • 1YU Zhi-shui, QIAN Yi-yu, ZHOU Fang-ming, et al.Joint strength and fracture behavior in arc brazed galvanized steel sheet[J]. Chinese Journal of Mechanical Engineering, 2001, 37(10): 88 - 92. 被引量:1
  • 2于治水,祁凯,李瑞峰,周方明,吴铭方,钱乙余.钛及钛合金电弧钎焊及接头强度[J].稀有金属材料与工程,2003,32(12):1049-1052. 被引量:4
  • 3Fujii H, Shiraki A. Development of arc-brazing welding method and application of pulsed MIG welding to various thin plates [J]. National Technical Report,1997, 23(2): 23-31. 被引量:1
  • 4Frings A, Stockel S. Fully mechanized inert-gas metalarc brazing of galvanized thin steel sheet[J]. Schweien und Schneiden, 1986, 38(12): 624-629. 被引量:1
  • 5Frings A, Stockel S. Fully mechanized inert-gas metalarc brazing of aluminized thin steel sheet[J]. Schweien und Schneiden, 1989, 41(11): 577-583. 被引量:1
  • 6Nithiarasu P. An adaptive finite element procedure for solidification problems[J]. Heat and Mass Transfer,2000, 36: 223 - 229. 被引量:1
  • 7Sobolev V V, Guilemany J M, Martin A J. Investigation of droplet flattening during thermal spraying[J].Surface and Coatings Technology, 1999, 89: 82 - 89. 被引量:1
  • 8Kenneth A. Brakke Mathematics Department Susquehanna University Selinsgrove [M]. Surface Evolver Manual, 1998. 被引量:1
  • 9FAN Hong-gang, SHI Yao-wu, HUANG Yong, et al. Experimental analysis of influence factors on arc pressure force in TIG welding[J]. Welding Technology, 1995, 5: 3-5. 被引量:1
  • 10Sellyaenkov V N. Measurement of the pressure of a welding arc[J]. Welding Production, 1973, 20 (9):61 -63. 被引量:1

二级参考文献6

  • 1Zu Guoxing(祖国兴).Rare Metal Materials and Engineering (稀有金属材料与工程)[J],1990,19(2):47-50. 被引量:1
  • 2Wu C S,Comput Mater Sci,1998年,9卷,397页 被引量:1
  • 3武传松,金属学报,1997年,33卷,774页 被引量:1
  • 4Kim J W,Weld J,1995年,5卷,141s页 被引量:1
  • 5Tsai M C,Weld J,1990年,69卷,241s页 被引量:1
  • 6Lin M L,Metal Trans.B,1986年,17卷,601页 被引量:1

共引文献15

同被引文献14

  • 1QIAN Yi-yu.Penetrating behavior of eutectic liquid during Al/Cu contact reactive brazing[J].中国有色金属学会会刊:英文版,2001(5):664-666. 被引量:4
  • 2YAN J C.Microstructure and mechanical performance of weld-brazing joints of copper thick plates. Journal of Materials Science . 2007 被引量:1
  • 3YAN J C.Microstructure and mechanical performance of GTA weld brazed joints of copper thick plates. Science and Technology of Welding and Joining . 2006 被引量:1
  • 4HUANG M L,LOEHER T.Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders. Apply Physics Letter . 2005 被引量:1
  • 5ALAM M O,CHAN Y C.Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni (P)/Cu bond pad. Journal of Applied Physics . 2003 被引量:1
  • 6KARAMIS M B,TASDEMIRCI A,NAIR F.Microstructural analysis and discontinuities in the brazed zone of copper tubes. Journal of Materials . 2003 被引量:1
  • 7WANG R.Study of diffusion of Ag in Cu single crystals. Nuclear Instruments . 2002 被引量:1
  • 8R B Ballentine.The function of Ag in the P-Cu filler metal on the brazing. Welding Journal . 1994 被引量:1
  • 9Kim H K,Tu K N.Rate of Consumption of Cu in Soldering Accompanied by Ripening. Applied Physics . 1995 被引量:1
  • 10DIRNFELD S F,GABBAY R,RAMON J J,et al.Copper em-brittlement by silver brazing alloys. Materials Character-ization . 1991 被引量:1

引证文献1

投稿分析
职称考试

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部 意见反馈